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MediaTek Announces Filogic Connectivity Family with New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips
30 Sep 2021 - 02:15
HSINCHU, Taiwan – September 30, 2021 – MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek’s new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in...
MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks
09 Sep 2021 - 15:00
HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio? 900T chipset, expanding MediaTek's portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch of Kompanio 1300T, which is designed for premium tablets. MediaTek’s Kompanio platform combines powerful computing...
MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
11 Aug 2021 - 15:00
HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.
MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets
27 Jul 2021 - 14:30
HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to tablets with advanced 5G, multimedia, AI and gaming technologies for a premium user experience. Kompanio 1300T allows OEMs to build powerful,...
MediaTek Launches Helio G96 and Helio G88 SoCs Bringing Advanced Display and Photography Capabilities to Premium Smartphones
15 Jul 2021 - 13:30
HSINCHU, Taiwan – July 15, 2021 – MediaTek today announced two additions to its Helio G series: Helio G96 and Helio G88. The launch of these system-on-chips (SoCs) will give device makers the ability to provide powerful smartphone features with cutting-edge display and photography capabilities to bring intelligent mobile experiences to every customer.
MediaTek Launches Dimensity 5G Open Resource Architecture Giving Device Makers Access to More Customized Consumer Experiences
29 Jun 2021 - 08:30
HSINCHU, Taiwan – June 29, 2021 – MediaTek announced the Dimensity 5G Open Resource Architecture that provides brands with more flexibility to customize key 5G mobile device features to address different market segments. The open resource architecture gives smartphone brands closer-to-metal access to customize features for cameras, displays, graphics, artificial intelligence (AI) processing units...
MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software
19 May 2021 - 12:00
New Delhi, – May 19, 2021 – MediaTek, the world’s fourth-largest fabless semiconductor company, today announced its collaboration with Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, to accelerate the development of an Edge-AI Enabled Smart Device Eco-system. Tessolve launched the MAGIK2 family nano System on module (SoM)...
MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
13 May 2021 - 15:00
HSINCHU, Taiwan – May 13, 2021 – MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.
China Mobile Collaborates with Intel, HP and MediaTek to Deliver 5G Connected Modern PC Experiences to World’s Largest Network
13 May 2021 - 13:00
HSINCHU, Taiwan — May 13, 2021 — China Mobile will join forces with HP, Intel and MediaTek to collaborate on 5G-enabled PCs for the next-generation of connected modern PC experiences.
MediaTek and Samsung Introduce World’s First Wi-Fi 6E Enabled 8K TV
06 Apr 2021 - 21:00
HSINCHU, Taiwan – April 6, 2021 – MediaTek and Samsung today introduced the world’s first 8K QLED TV – the flagship Samsung 8K QLED Y21 – powered by MediaTek’s MT7921AU, delivering the fastest connectivity experiences through its cutting-edge Wi-Fi 6E capabilities. Following their announcement of the world’s first Wi-Fi 6 enabled 8K TV in 2020, MediaTek and Samsung are yet again driving the smart...
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